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Enhanced AirJet Mini G2 Cooler Offers 42% Boost in Cooling Efficiency in Its Compact Design

Second-Generation AirJet Mini Solid-State Cooling Chip Unveiled by Frore Systems at Computex, Boasting a 50% Enhancement in Heat Dissipation Within the Same Compact Design.

Frore Systems introduces an upgraded AirJet Mini solid-state cooling chip at Computex, offering a...
Frore Systems introduces an upgraded AirJet Mini solid-state cooling chip at Computex, offering a 50% boost in heat dissipation while maintaining the same compact size.

Enhanced AirJet Mini G2 Cooler Offers 42% Boost in Cooling Efficiency in Its Compact Design

Frore's 2nd Gen AirJet Mini: A Game-Changer in Active Cooling

Get ready for Frore Systems' latest innovation, the 2nd Generation AirJet Mini solid-state active cooling device! This bad boy offers a whopping 50% increase in cooling performance, all while maintaining the same sleek design. Showcased at Computex, the new model is poised to revolutionize Frore's Airjet technology, addressing the escalating cooling needs of today's tech-savvy devices.

No more clunky fans here! The AirJet Mini G2 outperforms conventional cooling methods by leaps and bounds. It can dissipate up to 7.5W of heat at 85 degrees Celsius die temperature and 25 degrees Celsius ambient temperature, all while generating 1750 Pascals of back pressure and emitting a mere 21 dBA of noise. Despite this impressive performance, the device remains compact with dimensions of 27.3mm × 41.6mm × 2.5mm and a weight of just 7 grams—that's over 42% higher performance compared to the original AirJet Mini!

How does it do it? Well, details are scarce for now, but internal optimizations seem to be the star of the show. With such performance gains, it's reasonable to anticipate that Frore will continue to refine its technology, offering even more high-performance coolers for various applications down the line.

Dust, water, and size? The AirJet Mini G2 has got you covered! Just like its predecessor, this bad boy is self-cleaning and water-resistant. Plus, multiple AirJet Mini G2 chips can be combined to dissipate more heat, making it possible to cool down even power-hungry devices. Four of these babies can dissipate 30W of heat—that's the same heat dissipation as CPUs inside low-power laptops!

So, who's using this tech? First up is Crevis, a South Korean manufacturer of industrial machine vision cameras. By integrating the AirJet Mini G2 cooling chip, they've addressed the thermal challenges associated with high-performance imaging, paving the way for better image quality and higher frame rates in a compact design.

But the fun doesn't stop there—expect a wide range of applications, including PCs, Wi-Fi hotspots, industrial system-on-modules, and SSDs. Intriguingly, Frore hinted at Iodyne, a SSD manufacturer, planning to upgrade their portable SSD with the AirJet Mini G2 for improved cooling.

Stay tuned for more on the cutting-edge tech world, and make sure to follow Tom's Hardware on Google News for our latest updates!

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[1] Edge AI Utilization of Innovative Thermal Solutions[2] Frore Systems' Series C Funding Paving the Way for Expansion[3] The Role of Solid-State Active Cooling in Consumer Electronics[4] Samsung Galaxy Book4 Edge: Pushing the Limits with Frore's AirJet Technology

The AirJet Mini Gen 2, a game-changer in solid-state active cooling, showcases Frore's advancements in data-and-cloud-computing technology, demonstrating the potential for improved cooling solutions in various devices such as PCs, Wi-Fi hotspots, and SSDs. Innovations like this underline the significance of technology in addressing the escalating cooling needs of today's tech-savvy devices.

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